What Vertiv shipped in 2026

Vertiv Completes Acquisition of ThermoKey, Expanding Heat Rejection Portfolio for AI Data Centers

Dedicated IT cooling: Keepingservers reliable across industries

Vertiv unveils high-capacity rack platform for AI and high-density IT deployments

Building the physical infrastructure foundation for NVIDIA MGX-based AI factories

Vertiv and NVIDIA are collaborating to develop converged infrastructure for AI factories based on NVIDIA MGX, enabling modular, scalable power, cooling, and controls. The partnership aims to reduce de…

World Energy Efficiency Day: The AI era’s defining challenge

The article highlights the growing energy demands of AI-driven data centers, with global electricity use projected to double by 2030. It emphasizes integrating power and cooling systems to improve eff…

Digital twins for operations: Intelligent management

Vertiv is collaborating with NVIDIA to leverage Omniverse for real-time digital twin (DT) platforms that optimize AI infrastructure operations. The integration enables dynamic modeling of high-density…

Vertiv™ PowerDirect Rack 33kW – A new standard in modern data center power

Vertiv introduced the PowerDirect Rack 33kW, a DC power system designed to improve energy efficiency and scalability for AI and hyperscale workloads. The solution reduces AC-DC conversion steps, frees…

What digital twins reveal about AI infrastructure design

Vertiv’s blog explains how digital twin technology, once used in NASA’s Apollo 13 mission, is now critical for designing AI-ready data centers. It details how Vertiv and NVIDIA Omniverse enable real-t…

Vertiv Power Innovation Day 2026: The macro forces shaping data center power in 2026

Vertiv’s Power Innovation Day 2026 panel discussed how rising AI workloads and next-gen chipsets are forcing data centers to rethink power delivery, moving from 415V AC to 800V DC and adopting hybrid …

Four dimensions of efficiency: A systems approach to digital infrastructure design

Vertiv highlights four critical efficiency dimensions—energy, water, materials, and carbon—for modern data center design, emphasizing integrated system approaches to balance performance, cost, and env…

Vertiv™ CoolChip CDU 2300

Vertiv™ Rack Extreme, High‑Density Rack‑Mount Equipment Platform

The technology trends shaping the future of the data center

Vertiv’s Frontiers report outlines five key trends—hybrid AC/DC systems, AI delivery models, on-site generation, digital twins, and liquid cooling—driven by AI and high-density compute. These trends a…

Vertiv™ CoolChip Fluid Network, Row Manifolds

Vertiv in the news

Vertiv expands fluid management services to help reduce water use during data center fluid system commissioning

A roadmap for the future chip coolant temperature

The Open Compute Project (OCP) and major silicon vendors (NVIDIA, AMD, Intel) collaborated on a white paper proposing a 30°C minimum coolant temperature standard for AI/ML hardware cooling. This stand…

AI and safety: How Vertiv embeds protection into every layer of the work

Reliable, ready future: Hydrogen fuel cells as backup power resource for AI data centers

Heat rejection cooling efficiency: Location, climate-based thermal management strategy